Ultron Systems, Inc. -- Semiconductor Products | Assembly Equipment

ASSEMBLY EQUIPMENT
--» Wafer/Frame Film Mounters	Mounts film frames to pre-diced wafers for subsequent dicing, cleaning, curing, expanding, etc.
--» UV Curing Systems	Cures UV tape -- which reduces initial high-adhesive strength -- for easy pickup of die from post-diced wafer.
--» Die-Matrix Expanders	Uniformly separates die on wafers and attaches a grip ring, allowing easier pickup of individual die.
--» Wafer Cleaning Systems	Immaculately cleans diced wafers by utilizing either a brush or brushless design.
--» Wafer Backgrinding Protective Film Remover	Delicately & uniformly removes the protective film that covers thinned wafers.
--» Wafer Backlapping Film Applicator	Uniformly and precisely applies a protective film to pre-thinned wafers for grinding.

SEMICONDUCTOR PROCESSING MATERIALS
--» Film/Tape - (Silicone-free Adhesive)	We are proud to be the manufacturer producing true Silicone-free film!
--» Film/Tape - (Standard UV Adhesive)	Exceptional quality film: Consistent and high adhesive strength & uniform elongation properties.
--» Film/Tape - (Antistatic UV Adhesive)	Our antistatic UV film dissipates negative ion buildup while retaining demanding standard film properties.
--» Grip Rings	Our grip rings are extremely strong, and are made to last!
--» Film Frames	Our 6" film frames integrate with 6" grip rings.
--» Grip Ring / Film Frame Shippers	Our shippers will hold the same-sized grip rings or film frames.
--» Grip Ring Separator Tool	Easily separate grip ring segments with our useful tool.
--» Grip Ring Magazines	Durable magazines for USI grip rings: Available in 6", 8", and even 12" size!