Mounter_UH114
DieMatrixExpander
Wafer_Cleaning_UH117
DieMatrixExpander
DieMatrixExpander
Model UH108 Series: (UH108, UH108-8, UH108-12)
Backlapping_UH108
8" & 12" chuck plate option shown
Backlapping_UH108_Chuck
Ultron Systems' Model UH108 Series Wafer Backlapping Film Applicators are the ideal benchtop solutions for your frontside protection tape application requirements. They offer a high degree of repeatable accuracy and are capable of cutting the film to the edge of the wafer -- including the alignment flats -- within 0.005" in less than 20 seconds. A wide range of features and options are available to ensure bubble-free lamination to all sizes and types of wafers.

FEATURES:
- Adjustable spring-loaded roller assembly ensures bubble-free lamination
- Adjustable cutting angle, depth, and diameter to control the amount of film overhang
- Adjustable roller pressure from topside to accommodate different film requirements
and various wafer thicknesses
- Cuts film to edge of wafer, including flats, within 0.005"
- Vacuum-securing wafer stage
- Wafer-centering mechanism
- Retractable cutting knife blade for operator safety
- Adjustable alignment pins accommodate any wafer size
- Adjustable cutter assembly for either a "contact cut" (wafers with alignment flat(s)) OR a "non-contact cut" (wafers with an alignment notch)
- Spring-loaded tensioner bar prevents wafer stress due to film stretch
- Operates with backed or non-backed film. Optional Take-up Roller Assembly available for film with backed liner.

OPTIONS:
- Protective Film Take-up Roller Assembly: A gear-driven take-up Roller Assembly is available for use with protective layer-backed films, which automatically winds the protective layer onto a plastic core for easy handling and disposal.
- Static Eliminator (with or without Power Safety Interlock Switch): A static ionization bar prevents static build-up caused from either the film unwinding or from the separation of the film from the protective layer.
- 'CE' Mark
[Model UH108-8]:
- 5" Wafer Capability
- 6" Wafer Capability
[Model UH108-12]:
- 8" & 12" Wafer Capability
*** REQUEST FURTHER DETAILED INFORMATION
Backlapping_UH108_Open
Backlapping_UH108_Cutter
PRODUCTS:
WAFER BACKLAPPING FILM APPLICATOR