An ideal tape would offer high adhesive strength -- for the securing of wafers/substrates -- that could be substantially reduced for easy removal after sawing. Ultron Systems' series of UV Curable Adhesive Plastic Tape delivers both of these process environments. In the pre-exposure state, the UV Tape has a very high adhesive strength, which upon exposure to UV light is reduced to a fraction of the original force. This is paramount for any process involving thin/fragile die where removal from conventional tapes simply is not possible.