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MODEL UH118 WAFER CLEANING SYSTEM is capable of cleaning 8-inch film frame-mounted wafers. Operation is semiautomatic and fully programmable via a touchscreen LCD panel, further eliminating operator variables. The system is microprocessor-controlled to assure precise, flexible, uniform, and repeatable cleaning. Like the Model UH117. up to 10 programs with up to 99 different cleaning/rinsing/drying steps of up to 999 seconds maximum can be stored for different processes. However, the Model UH118 boasts programmable brush speed and electronically adjustable workstage height (with built-in safety interlock) by entering substrate thickness. The Model UH118 Wafer Cleaning System provides dual liquid additive capability through independent channels in addition to the separate DI water channel. For more efficient drying, the unit is equipped with a dual heater system and a new 300 rpm air knife-assisted low-spin dry cycle. The Model UH118 takes wafer cleaning to the next level. |
