MODEL UH115 WAFER/FRAME TAPE APPLICATOR represents the next level of bubble-free lamination to all sizes of wafers and types of film frames and is based on the highly successful Models UH114/UH14-8. The tape unwinds along a new roller path so that "crease lines" (which are common to most mounters and occur at the point the unwound tape meets the tape roll) are eliminated from the lamination area. Unwinding the tape from the roll is also motor-assisted to facilitate the operator.

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