MODEL UH114/114-8 WAFER/FRAME TAPE APPLICATORS offer a high degree of control and versatility for your mounting requirements in affordable and easy to use benchtop packages. A wide range of standard features and available options assure bubble-free lamination to all sizes of wafers and types of film frames.

MODEL UH114-12 Wafer/Frame Tape Applicator offers 300mm wafer mounting capability in a benchtop unit. It features one-pass lamination which provides an extra safety margin when mounting particularly fragile wafers/substrates and the same kind of control and versatility as its smaller siblings.

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