 |
||||
|
||||
|
||||
MODELS UH108/108-8 WAFER BACKGRINDING TAPE APPLICATORS offer the ideal benchtop solution for frontside protection tape application requirements. They provide a high degree of repeatable accuracy and are capable of cutting the tape to the edge of the wafer within 0.005" in less than 20 seconds, while assuring even, bubble-free lamination.
|
