We are happy to introduce an advanced version of edge-contact wafer chuck for our tape mounter line that features a flat silicone sectionally grooved ring. In the event of a small vacuum leak at the edge of the wafer, only the vacuum in that section will be lost; the vacuum in the remaining sections will be maintained. As wafers get thinner, maintaining a good vacuum around the edge seal becomes increasingly difficult, resulting in wafer breakage during lamination. The new SofTouch Wafer Chuck minimizes this risk -- we have successfully laminated 8-inch, 6-mil thk and 5-inch, 3-mil thk silicon wafers using this design, which is currently offered in 5 and 6-inch sizes with one alignment flat and 8 and 12-inch sizes with no alignment flats. We are confident that the new SofTouch Wafer Chucks will permit the lamination of very thin wafers with solder bumps or air bridges with great success.
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