MODELS UH410, UH412, AND UH420 PRECISION DIE BONDERS feature a unique dual camera system on a single split screen monitor with independent monitoring and accurate positioning of both input and output stages via a X/Y-Theta electronic joystick. They were designed with an emphasis on flexibility, while maintaining a high degree of accuracy and control -- placement accuracy is 0.001" or less. The MODEL UH410 is the base model of the Eutectic Die Bonder line and features all of the controls necessary for accurate, consistent die attach, such as bonding force, scrub time, scrub frequency, and scrub amplitude; operator variables are eliminated. The MODEL UH412 adds preform pick-and-place capability in addition to a realtime Digital Bond Load Indicator. The MODEL UH420 is the epoxy die attach system in the bonder series. It features a self-contained, rotary microvalve displacement pump that is capable of delivering shots down to 0.010" in diameter.
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